Technical Specifications

Reaches and sustains the temperatures required by PAEK-family polymers without PTFE degradation or heat creep.

Max nozzle temp: 500°C; hardened steel 0.4mm nozzle; all-metal hot end pathway.

Essential for PEEK (350–400°C), PEKK (340–360°C), and ULTEM (370–395°C) processing temperatures.

Maintains first-layer adhesion for high-shrinkage polymers and prevents warping during long prints.

Max bed temp: 200°C; high-temp carbon fiber and borosilicate build plates included.

Eliminates first-layer adhesion failures common with PEEK and PEKK on unheated or low-temp beds.

Slows the cooling gradient for semi-crystalline polymers, reducing internal stress, delamination, and warping.

Active chamber heating to 90°C; insulated all-metal frame retains heat.

Non-negotiable for quality PEEK/PEKK/ULTEM prints — no heated chamber means failed high-temp parts.

Commercial-grade linear rails eliminate flex, backlash, and vibration for consistent layer placement.

HIWIN linear guideways on all axes; XYZ resolution 10µm; layer resolution 7µm.

Delivers repeatable tolerances on high-temp parts where dimensional accuracy is a design requirement.

Heat-resistant Kevlar belts maintain tension and don't stretch or creep under prolonged high-temp operation.

Ultra-wide Kevlar belts; max print speed 500mm/s; regular production speed 300mm/s.

Eliminates belt-related artifacts in PEEK prints that run for 24+ hours at elevated temperatures.

Three independent Z motors actively level the bed for every print run without manual intervention.

Triple Z-motor; automated XY alignment probe; supports IDEX multi-head alignment.

Critical for multi-material and soluble-support accuracy in complex high-temp assemblies.

Two extruders move independently — enabling duplication, mirror, and multi-material modes.

2 independent X-axis print heads; automated dual-head XY alignment; IDEX-native firmware.

Doubles throughput in duplication mode; enables soluble support for complex geometry in high-temp materials.

Print complex internal channels, overhangs, and undercuts with water-soluble supports, then dissolve them away.

Compatible with PVA, BVOH, and breakaway support materials on second extruder.

Enables PEEK structural parts with internal cooling channels or complex aerospace geometries impossible with single-head FFF.

Large, thermally-stable build surfaces for large functional parts with secure adhesion.

350 × 350 × 450 mm build volume; high-temp carbon fiber and borosilicate plates included.

Supports large-format PEEK/PEKK aerospace brackets and structural components with minimal warping.

Continuously removes particulates and volatile byproducts to maintain build environment and operator safety.

Built-in HEPA + active carbon filtration; optional 2" inlet/outlet for external extraction.

Reduces contamination and odor during high-temp prints; supports safe PEEK/PEKK processing in office environments.

Stores and dries filament in-chamber during printing to prevent moisture-related defects.

In-chamber filament storage; active drying during print; filament runout sensors.

Prevents hydrolysis and voids in hygroscopic high-temp polymers (PEEK, PA, ULTEM) during long runs.

No vendor lock-in — use any standard 1.75mm filament from any qualified supplier.

Standard 1.75mm filament; fully open material architecture; no chipped cartridges.

Use certified PEEK/PEKK grades optimized for your application. Buy at market rates, not captive pricing.

Powerful RepRap-compatible control board with full web UI for remote monitoring and control.

Duet 3 mainboard; web interface with remote access; voice control; 16GB internal storage.

Monitor and manage long high-temp print runs remotely; script automated workflows.

Ships with tested, material-specific slicer profiles ready to use. No proprietary slicer required.

PrusaSlicer pre-configured profiles; Cura support; RepRap firmware; MacOS/Windows/Linux.

Speeds material qualification and parameterization for PEEK/PEKK/ULTEM workflows.

Detects overheating conditions and cuts power to protect machine, parts, and facility.

Overheat protection; thermal runaway detection; optional auto shutoff; solid state relays.

Critical safety layer when operating at 500°C extruder temperatures during unattended overnight runs.

Meets industrial safety standards with quality-grade electrical components.

CE certified; German-manufactured wiring; solid state relays; 110V or 220V input.

Provides assurance for commercial buyers qualifying the system for industrial production environments.

Air-gapped operation for sensitive defense and government environments.

Offline secure mode removes network connectivity; ITAR-secure deployable option.

Enables use in controlled manufacturing environments where networked printers are not permitted.